CORK, Ireland--Researchers for years have devised cooling systems that sit next to or on top of chips and other hot components. Now, researchers in Ireland are trying to make one for inside these components.
The University of Limerick in Ireland, in conjunction with Cork's Tyndall Institute and other research organizations in the country, is working on a liquid cooling system for inside chip packages. Chip packages are those blue/brown plastic sleeves that surround semiconductors and let them plug into a board. When you look at a chip, you're really looking at the package.
In this system, a … Read more